Assembly Capability
Capabilities
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Assembly Capability

PCB Assembly Capability
1 Min. IC Pitch 0.30mm(12mil)
2 Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
3 Min. Chip Placement  01005
4 Max. PCB Size 410mm x 600mm(16.2" x 23.6")
5 Type of assembly THD,SMT,SMT&THD Mixed
6 Maximum BGA Size 74mm x 74mm(2.9" x 2.9")
7 BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
8 BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
9 QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
10 Testing Service IC programming, custom testing, free DFM checking, ICT, FCT.
11 Package Anti-static Bubble Bag & Carton

Product Type

Qty

Normal lead time

Quick-turn lead time

SMT

5~200

2WD

8H

SMT

201~2000

3-5WD

2WD

SMT

≥2000

6WD

3WD

SMT+DIP

5~200

3WD

2WD

SMT+DIP

201~2000

5WD

4WD

SMT+DIP

≥2000

7WD

5WD

 
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