• 86-755-29113985
  • No.2 Building,GuangYu Industry Park, Xixiang, Bao'an District, Shenzhen China


Shanxu offers the following electronic manufacturing services:

Soldering Assembly

Our engineering and manufacturing staff has the expertise and experience to solder assemble your components using either conventional soldering methods or S-Bond solder, depending on the application.


Box Build Assembly

Our continuous development of suppliers from the component level to metal and plastic fabricators enables us to meet the most demanding schedules with full PCB assembly, ShanXu also has a clear competitive edge in the total turnkey market.


BGA Assembly

Ball grid array(BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability.


Prototype PCB Assembly

Prototype Services

Fast sample supply

Fast turn around time

Materials procurement and issue materials

Manual or Machine Build

Design & Production Engineering reviews


SMT Assembly

ShanXu offers the following Surface Mount Technology capabilities:     

· AOI (Automated Optical Inspection)
· X-Ray Inspection
· 0201 Chip Placement
· Fine Pitch
· Selective Soldering


DIP Assembly

Automated DIP Assembly

ShanXu uses automated through-hole equipment to assemble products at the highest quality level possible in a cost effective manner. The layout of the auto-insertion area is designed to minimize material handling and labor. ShanXu's equipment is well maintained by using a scheduled preventative maintenance program

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